>I can't see a problem, as long as the chips are not fraudulently resold.
In general, most components are only rated for 2 to 4 re-flow heating cycles before internal damage occurs. On some components the initial re-flow cycle brings the component into the rated tolerance, and for others the PCB forms a bimorph cantilever that physically fatigues the chip contacts/leads.
Production yields are only part of the Infant Mortality Phase of the bathtub curve.
Some components do get more stable with age if and only if left alone, but you can count those on one hand if you still have all your fingers. That is also a 3 hour pedantic conversation no one wants to have.
My intuition in this area is based on chips having a specification on maximum soldering temperature and duration. I'm not sure to what extent that is cumulative. I gather the vulnerability is the bonding of the gold whisker wires to the pads on the silicon, but you would want to check that.
Apart from the absolute temperature, chips have a recommended heating/cooling cycle, including heating/cooling rates. That suggests that differential expansion is a factor, which would likely be cumulative (more cycles = more likelihood of fatigue and damage).
The above is intuition, not the hard data you want.
I think what you are doing is a great idea (effectively demanufacturing). I'm hoping you can solve the practicalities, which as far as I can see are quality assurance and being able to guarantee a steady supply of components and a price point below new.
Any plans to retape the components so they can be put though a pick-and-place machine, or are you looking more towards manual rework? I can see that there is room for innovation in efficient ways to get components off boards at volume, as most component removal is in the form of manual rework.
Not really, and most autistic people I've met are very focused individuals. Met one guy whose whole world was the Unreal engine source, and unless you were talking about that specific area... could care less who you were.
Be kind to yourself first, and maybe get outside for a walk. Best regards =3
In general, most components are only rated for 2 to 4 re-flow heating cycles before internal damage occurs. On some components the initial re-flow cycle brings the component into the rated tolerance, and for others the PCB forms a bimorph cantilever that physically fatigues the chip contacts/leads.
Production yields are only part of the Infant Mortality Phase of the bathtub curve.
Some components do get more stable with age if and only if left alone, but you can count those on one hand if you still have all your fingers. That is also a 3 hour pedantic conversation no one wants to have.
I am secretly a sentient turnip... =3